What is the difference between COB displays and GOB displays in the industry?

 It is well known in the industry that COB is bound to become the trend of future displays. GOB, which is derived on the basis of SMD technology, is a transitional product in the industry.

 

So, what are the differences between GOB and COB? First, we need to understand what GOB is.

 

GOB (Glue on board) refers to pouring glue on the surface of the standard-mounted lamp. The production process is as follows: we produce LED modules according to the normal procedure, and then fill glue on the lamp surface of the LED module. When the glue dries, a strong protective layer is formed on the lamp surface of the module. This process is adopted to achieve the purposes of preventing bumps, waterproofing, dustproofing and shockproofing. Therefore, this technology is called GOB.

As shown in the figure below: First, the LED lamp surface is mounted in a conventional way, and then the next step of lamp surface glue filling is carried out. This means that all conventional modules can be produced by GOB surface glue filling. Manufacturers in the industry that do LED packaging can all achieve GOB packaging. Some manufacturers confuse concepts to sell at high profits: They also call GOB technology the normal-mounted COB packaging technology.

 

 

Because currently leading manufacturers in the industry such as Cinda and Lehman all adopt full flip-chip COB packaging.

 

COB (Chip on board) refers to directly bonding and packaging the chip on the entire substrate, that is, integrating N chips on the substrate and packaging them together. COB products directly package the LED chip in the concave lamp position on the PCB board, and then encapsulate and solidify it with epoxy resin glue. The surface of the lamp point protrudes into a spherical shape, thereby achieving advantages such as preventing bumps, waterproofing, dustproofing, anti-blue light, moistureproofing, and low power consumption, greatly improving the stability and service life of the product.

Simply put, COB can be understood as a packaging process. As the COB product technology is gradually improved and the market demand further evolves, on the pitch interval of 0.5mm to 1.0mm, the large-scale application of COB packaging technology will reflect its technical advantages and value.

 

To borrow a sentence from people in the industry: “COB packaging is tailor-made for a pitch of 1.0mm and below.”